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Cross-sectional observation device Product List

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Cross-sectional observation by SEM: Connector plating

Cross-sectional observation by SEM: Connector plating

Seeking the truth! If the communication worsens, it might be worth considering a malfunction in the connector terminal.

We would like to introduce a case study on cross-sectional observation of connector plating. We observed the cross-section to see how the plating condition of the connector terminals has changed due to usage. This time, we prepared cross-sectional samples from two locations with different degrees of streaks, one without streaks and one with streaks, to confirm the plating condition. As a result, it was found that compared to the area without streaks, Streak A and Streak B had uneven plating thickness. This is believed to be due to the plating being dragged during the insertion and removal of the connector, causing variations in thickness. 【Overview of Connector Plating Cross-Section】 ■ Cross-section preparation was done using a triple ion milling polisher (commonly known as CP) ■ The plating condition at the streaked locations was observed using SEM ■ Results - No streaks: Surface Au plating thickness is uniform (approximately 350nm) - Streak A: Surface Au plating thickness is uneven (approximately 490nm / approximately 350nm) - Streak B: Surface Au plating thickness is uneven (approximately 130nm / approximately 650nm) *For more details, please refer to the PDF document or feel free to contact us.

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Observation of CMOS image sensor cross-section by mechanical polishing.

Observation of CMOS image sensor cross-section by mechanical polishing.

Due to the presence of both advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, and so on!

At our company, we created cross-sections of the CMOS image sensor components accompanying the VR goggles manufactured by Company A through mechanical polishing in their original state, and conducted structural observations of the CMOS sensor components. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation methods. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

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Cross beam FIB cross-sectional observation

Cross beam FIB cross-sectional observation

It is possible to observe cross-sections while observing FIB processing in real time.

A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.

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  • Analysis and prediction system
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[Data] Cross-sectional observation of solar cell modules

[Data] Cross-sectional observation of solar cell modules

We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!

This document introduces the cross-sectional observation of solar cell modules. After inspecting the solar cell module that underwent thermal shock testing, cross-sectional observations were conducted at the identified areas of abnormality, confirming that the interconnector solder joint had fractured. 【Contents】 ■ Cross-sectional observation of the fracture ■ Elemental map of the fracture *For more details, please refer to the PDF document or feel free to contact us.

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Observation of ceramic substrates

Observation of ceramic substrates

By visualizing the crystal structure, it is possible to investigate the interrelationship between material properties and microstructure, as well as quality improvements aimed at enhancing material properties!

We conduct "observation of ceramic substrates and ceramic packages." Ceramic substrates and ceramic packages are utilized in fields that require high reliability, such as automotive, communication infrastructure, power semiconductors, and industrial equipment. We visualize the internal structures that support their performance and reliability through cross-sectional analysis, assisting in quality improvement, defect analysis, and competitive research. 【Overview】 ■ Cross-sectional observation ■ Elemental analysis (EDX) ■ Crystal analysis (EBSD) *For more details, please download the PDF or feel free to contact us.

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Lens Analysis: Cross-Section Observation <Cut Sample>

Lens Analysis: Cross-Section Observation <Cut Sample>

It is possible to grasp the shape and see approximate dimensions! Strongly supports manufacturing.

At our company, regardless of the lenses or lens units, we can understand the shape and approximate dimensions through cross-sectional observation. For products that fit within approximately φ3cm × 3cm, we are open to consultations regarding measuring specified areas, from resin solidification to cut samples, if requested. Tokyo Shinbi Optical Electronics strongly supports your manufacturing with various experiences and know-how cultivated in micro-lens development. 【Case Overview】 ■ Measurement Items ・Cross-sectional observation ・Dimension measurement ■ Measuring Instruments ・Polishing machine "Struers TegraSystem" ・Measuring microscope "Nikon MM-800/LFA" *For more details, please refer to the PDF document or feel free to contact us.

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